@article{7991,
  author = {F. M. M. Souren and J. Rentsch and M. C. M. van de Sanden},
  title = {Relation between light trapping and surface topography of plasma textured crystalline silicon wafers},
  abstract = {Currently, in the photovoltaic industry, wet chemical etching technologies are used for saw damage removal and surface texturing. Alternative to wet chemical etching is plasma etching. However, as for example, the linear microwave plasma technique, developed by Roth&Rau, has not been implemented in the photovoltaic industry for etching, because of the very low etch rate (},
  year = {2015},
  journal = {Progress in Photovoltaics: Research and Applications},
  volume = {23},
  pages = {352-366},
  doi = {10.1002/pip.2439},
  language = {eng},
}