Publications
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The Energy Dependence of the Ratio of Step and Terrace Reactivity for H-2 Dissociation on Stepped Platinum, Angew. Chem.-Int. Edit. 50 (2011) 5174-5177.
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Erosion yields of carbon under various plasma conditions in Pilot-PSI, J. Nucl. Mater. 415 (2011) S149-S152.
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Excellent Si surface passivation by low temperature SiO2 using an ultrathin Al2O3 capping film, Phys. Status Solidi-Rapid Res. Lett. 5 (2011) 22-24.
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ELM simulation experiments on Pilot-PSI using simultaneous high flux plasma and transient heat/particle source, Nucl. Fusion 751 (2011) 073008.
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Er3+ and Si luminescence of atomic layer deposited Er-doped Al2O3 thin films on Si(100), J. Appl. Phys. 109 (2011) 9.
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Encapsulation of Metal Cations by the PhePhe Ligand: A Cation-pi Ion Cage, J. Am. Chem. Soc. 24133 (2011) 9376-9386.
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Effect of ion bombardment on the a-Si:H based surface passivation of c-Si surfaces, Appl. Phys. Lett. 98 (2011) 3.
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Evidence that the reversible strain effect on critical current density and flux pinning in Bi2Sr2Ca2Cu3Ox tapes is caused entirely by the pressure dependence of the critical temperature, Supercond. Sci. Technol. 324 (2011) 032001.
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Evidence for the Role of Tetramethylethylenediamine in Aqueous Negishi Cross-Coupling: Synthesis of Nonproteinogenic Phenylalanine Derivatives on Water, J. Org. Chem. 576 (2011) 1727-1734.
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On the Effect of the Amorphous Silicon Microstructure on the Grain Size of Solid Phase Crystallized Polycrystalline Silicon, Adv. Energy Mater. 1 (2011) 401-406.
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The Engineering Analysis In Support Of The Iter Electron Cyclotron Heating And Current Drive Transmission Lines, Fusion Sci. Technol. 459 (2011) 718-728.
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Effective passivation of Si surfaces by plasma deposited SiOx/a-SiNx:H stacks, Appl. Phys. Lett. 98 (2011) 222102.
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Erratum to 'Co-adsorption of NH(3) and SO(2) on quartz(0 0 0 1): Formation of a stabilized complex (vol 511, pg 270, 2011)', Chem. Phys. Lett. 1-3516 (2011) 111-111.
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Enhancing the Wettability of High Aspect-Ratio Through-Silicon Vias Lined with LPCVD Silicon Nitride or PE-ALD Titanium Nitride for Void-Free Bottom-Up Copper Electroplating, IEEE Trans. Compon. Pack. Manuf. Technol. 1 (2011) 1728-1738.
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Edge pedestal characteristics in JET and JT-60U tokamaks under variable toroidal field ripple, Nucl. Fusion 1151 (2011) 113004.
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Extending Virtual Reality simulation of ITER maintenance operations with dynamic effects, Fusion Eng. Des. 9-1186 (2011) 2082-2086.
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