F. Roozeboom

Saadaoui, M., van Zeijl, H., Wien, W. H. A., Pham, H. T. M., Kwakernaak, C., Knoops, H. C. M., … Sarro, P. M. (2011). Enhancing the Wettability of High Aspect-Ratio Through-Silicon Vias Lined with LPCVD Silicon Nitride or PE-ALD Titanium Nitride for Void-Free Bottom-Up Copper Electroplating. Ieee Transactions on Components Packaging and Manufacturing Technology, 1(11), 1728-1738. https://doi.org/10.1109/TCPMT.2011.2167969 (Original work published 2011)

Leick, N., Verkuijlen, R. O. F., Lamagna, L., Langereis, E., Rushworth, S., Roozeboom, F., … Kessels, W. M. M. (2011). Atomic layer deposition of Ru from CpRu(CO)(2)Et using O-2 gas and O-2 plasma. Journal of Vacuum Science & Technology A, 29(2), 021016. https://doi.org/10.1116/1.3554691 (Original work published 2011)

Langereis, E., Roijmans, R., Roozeboom, F., van de Sanden, M. C. M., & Kessels, W. M. M. (2011). Remote Plasma ALD of SrTiO3 Using Cyclopentadienlyl-Based Ti and Sr Precursors. Journal of the Electrochemical Society, 158(2), G34-G38. https://doi.org/10.1149/1.3522768

Jinesh, K. B., van Hemmen, J. L., van de Sanden, M. C. M., Roozeboom, F., Klootwijk, J. H., Besling, W. F. A., & Kessels, W. M. M. (2011). Dielectric Properties of Thermal and Plasma-Assisted Atomic Layer Deposited Al2O3 Thin Films. Journal of the Electrochemical Society, 158(2), G21-G26. https://doi.org/10.1149/1.3517430