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Relation between light trapping and surface topography of plasma textured crystalline silicon wafers

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Author
Abstract

Currently, in the photovoltaic industry, wet chemical etching technologies are used for saw damage removal and surface texturing. Alternative to wet chemical etching is plasma etching. However, as for example, the linear microwave plasma technique, developed by Roth&Rau, has not been implemented in the photovoltaic industry for etching, because of the very low etch rate (

Year of Publication
2015
Journal
Progress in Photovoltaics: Research and Applications
Volume
23
Issue
3
Number of Pages
352-366
DOI
PId
c9169d3e6ae4502bf2c83646b23245aa
Alternate Journal
Prog. Photovolt.: Res. Appl.
Journal Article
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