DIFFER
Plasma Material Interactions Publications

Plasma Material Interactions Publications

Displaying 101 - 110 of 318

2019

R. E. Nygren, G. F. Matthews, T. W. Morgan, S. A. Silburn, J. H. Rosenfeld, M. North, A. Tallarigo, V. N. Stavila , Post-test examination of a Li-Ta heat pipe exposed to H plasma in Magnum PSI , Fusion Engineering and Design , 146 (2019) 2603-2607, DOI

2018

T. W. Morgan, P. Rindt, G. G. van Eden, V. Kvon, M. A. Jaworski, N. J. Lopes Cardozo , Liquid metals as a divertor plasma facing material explored using the Pilot-PSI and Magnum-PSI linear devices , Plasma Physics and Controlled Fusion , 60 (2018) 014025 ,Open Access , 2018_67341.pdf , DOI
D. Kogut, D. Aussems, N. Ning, K. Bystrov, A. Gicquel, J. Achard, O. Brinza, Y. Addab, C. Martin, C. Pardanaud , et al. , Single-crystal and polycrystalline diamond erosion studies in Pilot-PSI , Journal of Nuclear Materials , 500 (2018) 110-118 ,Open Access , 2018_67928.pdf , DOI
L. Tanure, A. Bakaeva, L. Lapeire, D. Terentyev, M. Vilémová, J. Matejicek, K. Verbeken , Nano-hardness, EBSD analysis and mechanical behavior of ultra-fine grain tungsten for fusion applications as plasma facing material , Surface and Coatings Technology , 355 (2018) 252-258 ,Open Access , 2018_68131.pdf , DOI
D. U. B. Aussems, T. W. Morgan, M. C. M. van de Sanden, E. Neyts , Mechanisms of elementary hydrogen ion-surface interactions during multilayer graphene etching at high surface temperature as a function of flux , Carbon , 137 (2018) 527-532 ,Open Access , 2018_68373.pdf , DOI
M. L. Reinke, J. L. Terry, G. G. van Eden, B. J. Peterson, K. Mukai, T. K. Gray, B. C. Stratton , Experimental tests of an infrared video bolometer on Alcator C-Mod , Review of Scientific Instruments , 89 (2018) 103507 ,Open Access , 2018_68665.pdf , DOI
A. Bakaeva, D. Terentyev, T. W. Morgan, A. Dubinko, W. van Renterghem, L. Tanure, K. Verbeken , Impact of plastic deformation on retention under pure D or He high flux plasma expose , Nuclear Materials and Energy , 15 (2018) 48-54 ,Open Access , DOI